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「Dust, foreign matter」related product list
AGZⅣ
PIEZONIZER Series
Assembly processesPC board mounting processesInspection processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterShort rangePrintingcoating processesforeign matter
BF-XME
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort rangeSpace-savingPrintingcoating processesforeign matter
BF-X4ME
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort rangePrintingcoating processesforeign matter
ZappⅢ
AC-type compact ionizer, with mini-piezoelectric transformer built-in
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesWrapping/Packaging processesResin moldsFilmsGlassLensesDust, foreign matterParts feedersShort rangeSpace-savingPrintingcoating processesforeign matter
BF-X2MC
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort range
BF-XMB
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort rangeSpace-saving
BF-X2ME
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort range
BF-X4MB
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort range
BF-6MB
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort range
BF-OHP3B
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort range
BF-SZAⅡ
WINSTAT Series
LCD panelsAssembly processesPC board mounting processesInspection processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort rangeSpace-savingPrintingcoating processesforeign matter
BF-XZB
WINSTAT Series
LCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort rangeSpace-saving
BF-X2ZB-V2
WINSTAT Series
LCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort range
BF-X4ZB
WINSTAT Series
LCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort range
ZappⅡ
PIEZONIZER Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassLensesDust, foreign matterParts feedersShort rangeSpace-saving
ZappⅡ-L
PIEZONIZER Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassLensesDust, foreign matterParts feedersShort rangeSpace-saving
AGZⅢ
PIEZONIZER Series
Assembly processesPC board mounting processesInspection processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterShort rangePrintingcoating processesforeign matter
AGZⅢ-PA
PIEZONIZER Series
Assembly processesPC board mounting processesInspection processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterShort rangePrintingcoating processesforeign matter
ANZ-SC3
PIEZONIZER Series
Assembly processesLensesDust, foreign matterShort range
CABX
ELIMINOSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort rangePrintingcoating processesforeign matter
SAT-11
ELIMINOSTAT Series
LCD panelsAssembly processesPC board mounting processesInspection processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort rangeNo blowingPrintingcoating processesforeign matter
SAT-20
ELIMINOSTAT Series
LCD panelsAssembly processesPC board mounting processesInspection processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort rangeNo blowingPrintingcoating processesforeign matter
AT-10
ELIMINOSTAT Series
LCD panelsAssembly processesPC board mounting processesInspection processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort rangeNo blowingPrintingcoating processesforeign matter
![BJS [Bar type] ELIMINOSTAT Series](https://www.shishido-esd.co.jp/en/wp-content/uploads/sites/2/2019/01/bjs.jpg)
BJS [Bar type]
ELIMINOSTAT Series
LCD panelsAssembly processesPC board mounting processesInspection processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort rangeNo blowingSpace-savingPrintingcoating processesforeign matter
![BOS [Bar type] ELIMINOSTAT Series](https://www.shishido-esd.co.jp/en/wp-content/uploads/sites/2/2019/01/bos.jpg)
BOS [Bar type]
ELIMINOSTAT Series
LCD panelsAssembly processesPC board mounting processesInspection processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterShort rangeNo blowingPrintingcoating processesforeign matter
![AP-5 [Air type] ELIMINOSTAT Series](https://www.shishido-esd.co.jp/en/wp-content/uploads/sites/2/2019/01/ap-5.jpg)
AP-5 [Air type]
ELIMINOSTAT Series
LCD panelsAssembly processesPC board mounting processesInspection processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort rangeSpace-savingPrintingcoating processesforeign matter
![AG-5 [Air type] ELIMINOSTAT Series](https://www.shishido-esd.co.jp/en/wp-content/uploads/sites/2/2019/01/ag-5.jpg)
AG-5 [Air type]
ELIMINOSTAT Series
LCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterShort range
![BUAS [Air type] ELIMINOSTAT Series](https://www.shishido-esd.co.jp/en/wp-content/uploads/sites/2/2019/01/buas.jpg)
BUAS [Air type]
ELIMINOSTAT Series
LCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterLong rangeSpace-saving
![FAPS-GP [Air type] ELIMINOSTAT Series](https://www.shishido-esd.co.jp/en/wp-content/uploads/sites/2/2019/01/faps-gp.jpg)
FAPS-GP [Air type]
ELIMINOSTAT Series
LCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterLong range
DC-ESR-C
ELIMINOSTAT Series
Semiconductors/Electronic devicesDust, foreign matterLong rangeNo blowingCleanroomforeign matter
Trz:CuBe
DUST HALER Series
Dust, foreign matter
Trz:MaXi
DUST HALER Series
Dust, foreign matter