WINSTAT Series
Air ionizers for static elimination in all industries, to address ESD (electrostatic discharge) problems in the electronics industry, and provide anti-static measures for plastic films. Air ionized by corona discharge at the emitter electrode is blown by a fan, so it can neutralize static of charged objects located some distance away, and thereby prevent static trouble. The fan enables static elimination over a wide range and at a distance. An extensive range of models is available—including high frequency, AC, and DC types—to handle virtually any application for equipment, on the desktop, or as part of a production line.
HDC-AC
![BF-XME WINSTAT Series](https://www.shishido-esd.co.jp/en/wp-content/uploads/sites/2/2023/06/bf-xme.jpg)
BF-XME
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort rangeSpace-savingPrintingcoating processesforeign matter
![BF-X4ME WINSTAT Series](https://www.shishido-esd.co.jp/en/wp-content/uploads/sites/2/2022/12/BF-X4ME.jpg)
BF-X4ME
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort rangePrintingcoating processesforeign matter
![BF-X2MC WINSTAT Series](https://www.shishido-esd.co.jp/en/wp-content/uploads/sites/2/2019/01/bf-x2mc.jpg)
BF-X2MC
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort range
![BF-XMB WINSTAT Series](https://www.shishido-esd.co.jp/en/wp-content/uploads/sites/2/2019/01/bf-xmb.jpg)
BF-XMB
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort rangeSpace-saving
![BF-X2ME WINSTAT Series](https://www.shishido-esd.co.jp/en/wp-content/uploads/sites/2/2019/01/bf-x2me.jpg)
BF-X2ME
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort range
![BF-X4MB WINSTAT Series](https://www.shishido-esd.co.jp/en/wp-content/uploads/sites/2/2019/01/bf-x4mb.jpg)
BF-X4MB
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort range
![BF-6MB WINSTAT Series](https://www.shishido-esd.co.jp/en/wp-content/uploads/sites/2/2019/01/bf-6mb.jpg)
BF-6MB
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort range
![BF-OHP3B WINSTAT Series](https://www.shishido-esd.co.jp/en/wp-content/uploads/sites/2/2019/01/bf-ohp3b.jpg)
BF-OHP3B
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort range
High-frequency type
![BF-SZAⅡ WINSTAT Series](https://www.shishido-esd.co.jp/en/wp-content/uploads/sites/2/2019/01/bf-sza2.jpg)
BF-SZAⅡ
WINSTAT Series
LCD panelsAssembly processesPC board mounting processesInspection processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort rangeSpace-savingPrintingcoating processesforeign matter
![BF-XZB WINSTAT Series](https://www.shishido-esd.co.jp/en/wp-content/uploads/sites/2/2019/01/bf-xzb.jpg)
BF-XZB
WINSTAT Series
LCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort rangeSpace-saving
![BF-X2ZB-V2 WINSTAT Series](https://www.shishido-esd.co.jp/en/wp-content/uploads/sites/2/2019/01/bf-x2zb-v2.jpg)
BF-X2ZB-V2
WINSTAT Series
LCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort range
![BF-X4ZB WINSTAT Series](https://www.shishido-esd.co.jp/en/wp-content/uploads/sites/2/2019/01/bf-x4zb.jpg)
BF-X4ZB
WINSTAT Series
LCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort range