HDC-AC
![BF-XME WINSTAT Series](https://www.shishido-esd.co.jp/en/wp-content/uploads/sites/2/2023/06/bf-xme.jpg)
BF-XME
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort rangeSpace-savingPrintingcoating processesforeign matter
![BF-X4ME WINSTAT Series](https://www.shishido-esd.co.jp/en/wp-content/uploads/sites/2/2022/12/BF-X4ME.jpg)
BF-X4ME
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort rangePrintingcoating processesforeign matter
![BF-X2MC WINSTAT Series](https://www.shishido-esd.co.jp/en/wp-content/uploads/sites/2/2019/01/bf-x2mc.jpg)
BF-X2MC
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort range
![BF-XMB WINSTAT Series](https://www.shishido-esd.co.jp/en/wp-content/uploads/sites/2/2019/01/bf-xmb.jpg)
BF-XMB
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort rangeSpace-saving
![BF-X2ME WINSTAT Series](https://www.shishido-esd.co.jp/en/wp-content/uploads/sites/2/2019/01/bf-x2me.jpg)
BF-X2ME
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort range
![BF-X4MB WINSTAT Series](https://www.shishido-esd.co.jp/en/wp-content/uploads/sites/2/2019/01/bf-x4mb.jpg)
BF-X4MB
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort range
![BF-6MB WINSTAT Series](https://www.shishido-esd.co.jp/en/wp-content/uploads/sites/2/2019/01/bf-6mb.jpg)
BF-6MB
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort range
![BF-OHP3B WINSTAT Series](https://www.shishido-esd.co.jp/en/wp-content/uploads/sites/2/2019/01/bf-ohp3b.jpg)
BF-OHP3B
WINSTAT Series
Semiconductors/Electronic devicesLCD panelsAssembly processesPC board mounting processesInspection processesPrinting, coating processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterParts feedersShort range