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AGZⅣ PIEZONIZER Series

AGZⅣ
PIEZONIZER Series

Assembly processesPC board mounting processesInspection processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterShort rangePrintingcoating processesforeign matter
AGZⅢ PIEZONIZER Series

AGZⅢ
PIEZONIZER Series

Assembly processesPC board mounting processesInspection processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterShort rangePrintingcoating processesforeign matter
AGZⅢ-PA PIEZONIZER Series

AGZⅢ-PA
PIEZONIZER Series

Assembly processesPC board mounting processesInspection processesWrapping/Packaging processesResin moldsFilmsGlassDust, foreign matterShort rangePrintingcoating processesforeign matter
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Semiconductors/Electronic devices LCD panels Assembly processes PC board mounting processes Inspection processes Printing, coating processes Wrapping/Packaging processes Resin molds Films Glass Lenses Dust, foreign matter Parts feeders Short range Long range No blowing Cleanroom Space-saving Explosion-proof specifications Static measurement Charging equipment Anti-static agents Heat resistance
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